Applications are invited from African nationals for scholarships in the fields of Industrial & Manufacturing Engineering, Mechanical Engineering, Materials and Metallurgical Engineering and Biomaterials/Biomedical Engineering. In this ELbM scholarships call, a total of 16 scholarships comprising of 9 Masters (3 credit seeking and 6 degree seeking), 4 PhDs (2 credit seeking and 2 degree seeking) and 3 Staff scholarships are available. ELbM scholarships are jointly administered by four (4) African partner institutions, where selected students and staff will be able to engage in postgraduate studies, research, teaching or training.

SCHOLARSHIPPARTNER UNIVERSITIES
The ELbM scholarship includes a one round tripair
ticket and visa costs, participation costs such
as tuition fees, registration and service fees,
Insurance (Health, accident, travel), settling-in
allowance, monthly subsistence allowance and a
contribution towards the research costs
associated with student mobility of 10 months or
longer.
Botswana International University of Science and
Technology, Botswana -(Coordinating Partner)
Stellenbosch University, South Africa
Federal University of Petroleum Resources, Nigeria
Jomo Kenyatta University of Agriculture, Kenya
Council for Scientific & Industrial Research/Laser-based
Manufacturing Research Group, (CSIR/LEM), South
Africa. – Associate Partner
African Laser Centre (ALC), South Africa. – Associate
Partner
Universita di Bologna, Italy – Technical Partner
  • Previous and current recipients of Intra ACP or Intra Africa Scholarships are not eligible to apply for this scholarship.
  • The ELbM consortium is committed to offering 50% of its scholarship to women and disadvantaged or marginalized groups.

APPLY ONLINE
DEADLINE: 31st January 2021
https://scholarship.elbmmobility.org
For more information email: info@elbmmobility.org

This project has been funded by the Intra- Africa Academic Mobility Scheme of the European Union. This publication reflects the views only of the ELbM partnership, and the Commission cannot be held responsible for any use which may be made of the information contained therein.